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Tungsten copper alloy is mainly used

Tungsten-copper alloy combines the advantages of metal tungsten and copper, among which tungsten has a high melting point (tungsten melting point is 3410 ° C, copper melting point is 1080 ° C), high density (tungsten density is 19.34g/cm3, copper density is 8.89 g/cm3) ; Copper has excellent electrical and thermal conductivity, tungsten-copper alloys (generally ranging from WCu7 to WCu50) have uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; moderate electrical and thermal conductivity, widely used in military high temperature resistant materials , Electrical alloys for high-voltage switches, electrical processing electrodes, and microelectronic materials are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries as parts and components. Tungsten copper alloys are used as nozzles, gas rudders, air rudders, and nose cones of missiles and rocket engines in aerospace. The main requirements are high temperature resistance (3000K~5000K) and high temperature airflow scouring ability. Copper is mainly used at high temperature. The perspiration and cooling effect formed by volatilization (the melting point of copper is 1083°C) reduces the surface temperature of tungsten copper and ensures that it can be used under extreme conditions of high temperature. Tungsten copper alloy is widely used in high-voltage switch 128kV SF6 circuit breaker WCu/CuCr, high-voltage vacuum load switch (12kV 40.5KV 1000A), and arrester. High-voltage vacuum switch is small in size, easy to maintain, and has a wide range of applications. Use in flammable, explosive and corrosive environments. The main performance requirements are arc ablation resistance, anti-welding resistance, small cut-off current, low gas content, and low thermal electron emission capability. In addition to the conventional macro performance requirements, porosity and microstructure properties are also required. Therefore, special processes are required, including complex processes such as vacuum degassing and vacuum infiltration.
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